Solder joint fatigue life of fleXBGA/sup TM/ assemblies

fleXBGAu/sup TM/ is a chip scale package offered by Amkor. The package is based on a flex circuit (tape) substrate, and has a die up, wire bonded, over molded configuration. This paper presents board level reliability data over a wide range of variables. The performance is also compared to /spl mu/BGA/sup TM/ TSOP packages.