Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot

Abstract Loose-abrasive wire sawing widely employed for slicing silicon ingots has problems of dirty working environment and inefficiency. Fixed-abrasive wires, namely electroplated diamond wires and resinoid diamond wires, have been developed to overcome these problems. Resinoid diamond wires, which can be produced at a lower cost, can be put to practical use, but they have a low breaking twist strength. In this study, metal powder is added to the resinoid bond to strengthen it. A series of experiments revealed that the breaking twist strength, heat resistance, tool wear resistance, and slicing efficiency of this wire are significantly improved.