Wire saw with ingot swing mechanism for improvement of sawing stability

By pressing a wire cut while turning the ingot discloses a wire saw for cutting a plurality of wafer. Elevating screw causes the cutting wire which runs the ingot to ingot elevating the lifting frame. Swing motor ingot then turning along the cutting plane of the ingot in the ingot swinging housing. Elevating guide rails that extend the plane are installed so as to intersect the cutting plane of the cutting wire, ingot swing motor is stable, by the link power transmission mechanism 1100 securely rotating force of the ingot swing motor to guide the elevating of the lifting frame a swing shaft is transmitted to the ingot. Link section 1130 of the link transfer mechanism 1100 is provided between the swing motor and the ingot swing axis in a pair with each other in a direction perpendicular to the cutting plane. According to this configuration, there can be provided a stable, solid and rigid wire saw equipment.