Bonding of copper surface in ambient air using propylene carbonate as passivation layer

Abstract. Bonding of a copper surface in a nonvacuum environment has been studied for the purpose of reducing manufacturing costs. Cu-Cu bonding in ambient air is demonstrated by using propylene carbonate (PPC) as a passivation layer. The decomposition of the PPC passivation layer during bonding would protect the copper surface from oxidation by providing a shielding gas atmosphere between the copper surface and the air. Further, the PPC passivation layer would also overcome the degradation of copper surface during storage in the atmosphere.

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