A novel package electrical characterization process-application on plastic BGA packages

A novel approach to a complete package electrical characterization process is presented. Two different plastic BGA packages are analyzed to illustrate this. The process begins by selecting a suitable electrical circuit model for study of the signal propagation path. Once the model is selected, the values for each of the circuit elements are computed using commercially available software (Ansoft/sup (R)/ & Pacific Numerix/sup (R)/). The electrical circuit model is used for preliminary product simulation and as a method to check for supplier conformity to package specification through verification using actual measurements. Package measurement using TDR and S-parameter techniques are carried out once the package is taped out. These measurement results are compared to those from modeling for validation. Corrections and adjustments are made to the package model for more accurate future package performance prediction. Finally, the limitations of the plastic BGA packages are summarized.

[1]  B. Young,et al.  Measurement of package inductance and capacitance matrices , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[2]  V. K. Tripathi,et al.  Time-domain characterization and circuit modeling of a multilayer ceramic package , 1996 .

[3]  A. P. Agrawal,et al.  Electrical characterization of BGA packages , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[4]  Clayton R. Paul,et al.  Analysis of Multiconductor Transmission Lines , 1994 .

[5]  D. Nay.  Calculation of Electrical Parameters of a Thin-Film Multichip Package , 1989 .

[6]  Bernard Flechet,et al.  A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains , 1996 .

[7]  Chi-Taou Tsai,et al.  An experimental technique for full package inductance matrix characterization , 1996 .

[8]  Madhavan Swaminathan,et al.  Electrical design of an MCM package for a multi-processor digital system , 1995 .

[9]  Lih-Tyng Hwang,et al.  Calculation of electrical parameters of a thin-film multichip package , 1989 .

[10]  Qi-Jun Zhang,et al.  Ground noise minimization in integrated circuit packages through pin assignment optimization , 1996 .

[11]  J. L. Prince,et al.  A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections , 1995 .

[12]  C. Gordon,et al.  Estimating crosstalk in multiconductor transmission lines , 1996 .

[13]  Lih-Tyng Hwang,et al.  Analysis of a multilayered-metal thin-film transmission line , 1995 .

[14]  C. Stanghan,et al.  Electrical Characterization of Packages for High-Speed Integrated Circuits , 1985 .

[15]  Bo Janko,et al.  Measuring Package and Interconnect Model Parameters Using Distributed Impedance , 1992, 40th ARFTG Conference Digest.

[16]  J. R. Brews,et al.  Guidelines for high-performance electronic package interconnections-a simple approach , 1996 .

[17]  Michael B. Steer,et al.  Experimental characterization of transmission lines in thin-film multichip modules , 1996 .

[18]  Hiroyuki Fujita,et al.  High speed electrical characterization and simulation of a pin grid array package , 1995 .