论文信息 - Etching a Micro-Trench with a Maximum Aspect Ratio of 60 on Silica Glass by Laser-Induced Backside Wet Etching (LIBWE)

Etching a Micro-Trench with a Maximum Aspect Ratio of 60 on Silica Glass by Laser-Induced Backside Wet Etching (LIBWE)

We have successfully fabricated a deep micro-trench about 7 µm wide and 420 µm deep on silica glass with a maximum aspect ratio of 60 by laser induced backside wet etching (LIBWE) via KrF laser ablation of a saturated pyrene/acetone solution. The processing time for the microetching was as short as 5 min at a repetition rate of 80 Hz and a fluence of F = 1.0 Jcm-2pulse-1. The etch rate was calculated to be approximately 17 nmpulse-1. The LIBWE method is shown to be very useful for surface microstructuring of silica glass with high aspect ratio and high throughput.

Aiko Narazaki | Yoshizo Kawaguchi | Hiroyuki Niino | Ryozo Kurosaki | Tadatake Sato

[1] J. Nishii,et al. Femtosecond laser-assisted three-dimensional microfabrication in silica. , 2001, Optics letters.

[2] H. Niino,et al. Laser-Induced Backside Wet Etching of Sapphire , 2003 .

[3] Thomas Lippert,et al. Fabrication of micro-optical elements in quartz by laser induced backside wet etching , 2003 .