Design and Characterization of Thin-Film System for Microsensors Embedding in Ti6Al4V Alloys

Reliable structures and systems are critical for numerous engineering applications. These systems are generally operated in harsh environments. Effective monitoring and diagnosis of these structures are of critical importance. To achieve this goal, thin-film micro/nano sensors can be embedded in metal structures to protect them from external harsh environments while providing measurements with desired special and temporal resolutions and accuracy, which cannot be achieved with traditional sensors. Targeting on new sensor applications in harsh environments, this paper presents experimental results on the design and characterization of a thin-film system, including diffusion barrier and insulation layers, for a successful sensor embedding in Ti6Al4V alloy through diffusion bonding. Based on the developed material system, an effective fabrication process of the Ti6Al4V-embedded thin-film PdCr strain gages was developed. The embedded sensors were validated by a functionality test and material characterization.

[1]  Anton Van der Ven,et al.  Theory of grain boundary diffusion induced by the Kirkendall effect , 2008 .

[2]  W. D. Westwood.  Physical Vapor Deposition , 1989 .

[3]  R. Bailey,et al.  High temperature static strain gage alloy development program. Final report , 1985 .

[4]  T. Orent,et al.  Investigation of the chemical bonding of Cr and Ti to silicon nitride , 1983 .

[5]  A. Datta,et al.  Microfabrication and characterization of metal-embedded thin-film thermomechanical microsensors for applications in hostile manufacturing environments , 2006, Journal of Microelectromechanical Systems.

[6]  M. F. Islam,et al.  Effect of surface finish and sheet thickness on isostatic diffusion bonding of superplastic Ti-6Al-4V , 1997 .

[7]  T. Yeh,et al.  Amorphouslike chemical vapor deposited tungsten diffusion barrier for copper metallization and effects of nitrogen addition , 1997 .

[8]  Mitsuo Niinomi,et al.  Recent research and development in titanium alloys for biomedical applications and healthcare goods , 2003 .

[9]  Xiaochun Li,et al.  Design, fabrication and characterization of metal embedded thin film thermocouples with various film thicknesses and junction sizes , 2006 .

[10]  J. M. Gonzalez,et al.  Developing Multilayer Thin Film Strain Sensors With High Thermal Stability , 2006 .

[11]  M. Nicholas.  Joining processes : introduction to brazing and diffusion bonding , 1998 .

[12]  R. Hance,et al.  Al/W/TiN/sub x//TiSi/sub y//Si barrier technology for 1.0- mu m contacts , 1988, IEEE Electron Device Letters.

[13]  N. F. Kazakov.  Diffusion bonding of materials , 1985 .

[14]  M. Donachie.  Titanium: A Technical Guide , 1988 .

[15]  Tao Liu,et al.  A study on the hardness variation of α- and β-pure titanium with different grain sizes , 2005 .

[16]  Xiaochun Li,et al.  Design, Fabrication, and Characterization of Metal Embedded Microphotonic Sensors , 2008 .

[17]  J. Wrbanek,et al.  Development of techniques to investigate sonoluminescence as a source of energy harvesting , 2007 .