论文信息 - Early resistance change and stress/electromigration modeling in aluminum interconnects - 字舞流文

Early resistance change and stress/electromigration modeling in aluminum interconnects

A. J. Mouthaan | Wim Schoenmaker | V. Petrescu | W. Schoenmaker | V. Petrescu | A. Mouthaan

[1] Andrea Scorzoni,et al. Resistance decay after electromigration as the effect of mechanical stress relaxation , 1993 .

[2] M. Korhonen,et al. Stress evolution due to electromigration in confined metal lines , 1993 .

[3] Gian Carlo Cardinali,et al. A resistometric method to characterize electromigration at the wafer level , 1990 .

[4] James R. Lloyd,et al. A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2 , 1986 .