Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
暂无分享,去创建一个
Tymon Barwicz | Swetha Kamlapurkar | Sebastian Engelmann | Alexander Janta-Polczynski | Elaine Cyr | Richard Langlois | Paul Fortier | Shotaro Takenobu | Darrell Childers | Nicolas Boyer | Yoichi Taira | Ted W. Lichoulas | Jerome Bougie | Alain Drouin | T. Barwicz | S. Engelmann | S. Kamlapurkar | N. Boyer | Alexander Janta-Polczynski | Y. Taira | S. Takenobu | D. Childers | Alain Drouin | R. Langlois | P. Fortier | Elaine Cyr | Jerome Bougie
[1] P ? ? ? ? ? ? ? % ? ? ? ? , 1991 .
[2] Tymon Barwicz,et al. A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities , 2016, IEEE Journal of Selected Topics in Quantum Electronics.
[3] Paul Fortier,et al. A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides , 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).
[4] Tymon Barwicz,et al. An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides , 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).
[5] Tymon Barwicz,et al. Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
[6] Tymon Barwicz,et al. Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
[7] Tymon Barwicz,et al. Enabling large-scale deployment of photonics through cost-efficient and scalable packaging , 2015, 2015 IEEE 12th International Conference on Group IV Photonics (GFP).
[8] Bert Jan Offrein,et al. Flip-chip optical couplers with scalable I/O count for silicon photonics. , 2013, Optics express.
[9] Tymon Barwicz,et al. Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension , 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
[10] Neil Genzlinger. A. and Q , 2006 .
[11] Paul Fortier,et al. Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability , 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).
[12] Tymon Barwicz,et al. Demonstration of self-aligned flip-chip photonic assembly with 1.1dB loss and > 120nm bandwidth , 2016 .
[13] Tymon Barwicz,et al. Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[14] Ciyuan Qiu,et al. Efficient coupler between chip-level and board-level optical waveguides. , 2011, Optics letters.
[15] Tymon Barwicz,et al. Flip chip assembly with sub-micron 3D re-alignment via solder surface tension , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[16] Tymon Barwicz,et al. Low-Cost Interfacing of Fibers to Nanophotonic Waveguides: Design for Fabrication and Assembly Tolerances , 2014, IEEE Photonics Journal.
[17] Tymon Barwicz,et al. Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices , 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
[18] Shotaro Takenobu,et al. Single-mode polymer optical interconnects for Si photonics with heat resistant and low loss at 1310/1550nm , 2012, 2012 38th European Conference and Exhibition on Optical Communications.
[19] Simon Laflamme,et al. Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides , 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).
[20] Tymon Barwicz,et al. Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
[21] Tymon Barwicz,et al. A compliant polymer interface with 1.4dB loss between standard fibers and nanophotonic waveguides , 2016 .