Fabrication of LIGA mold inserts

Abstract The present paper describes the fabrication sequence of a LIGA mold insert by electroforming after the patterning steps of the overall process. These tools are applied for large scale fabrication of microcomponents made by molding and embossing processes. The application of an intermediate layer system leads to optimized process performance and to a better surface quality of the mold insert. The plating processes are described and the materials properties, e.g. hardness, are used for the characterization of the recrystallization behavior of the electroformed nickel which yields the high temperature application limit of the tool.

[1]  W. Ehrfeld,et al.  ELECTROFORMING TECHNIQUES IN THE LIGA PROCESS FOR THE PRODUCTION OF MICRODEVICES , 1989 .

[2]  Kevin W. Kelly,et al.  Electroplated nickel mold insert for LIGA , 1995, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.