论文信息 - High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process - 字舞流文

High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process

H. Kiritani | A. Horibe | H. Mori | Y. Orii | Y. Kawase | Keiji Matsumoto | M. Ikemoto | Sugiyama Masaya | M. Yamazaki | F. Mizutani