IC-Package-System Integration Design

Miniature is massive when it comes to electronics. While there exists a continuous effort in industry to integrate more functionalities into the same area, the prohibitive scaling cost at 45nm and beyond makes it difficult to continue the trend. Towards this, More-than-Moore techniques have been proposed, which explore new dimensionality of integration by creating and integrating non-digital functionality to semiconductor products (Zhang and Roosmalen. More than Moore—creating hnanoelectronics systems/nanoelectronics systems. Springer, New York, 2009). They motivate new technological possibilities and unlimited application potential.

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