Apparatus for inspecting the defects on the wafer periphery and method of inspection

PURPOSE: An apparatus for inspecting defects of the border of a wafer and a method thereof are provided to prevent a loss occurring due to the crack of the wafer by detecting the wafers having a defect before processes for the wafer are progressed. CONSTITUTION: A reference position is determined on the border of a wafer. An image acquisition apparatus scans from the reference position and obtains image information. An angle between the light incident on the image acquisition apparatus from the reference position and the border is maintained uniformly during the scanning. After the acquisition of the image information, the acquired image information is processed properly to determine a defect and the position of the defect.