This article unifies two parameter-extraction methods to generate a consistent simulation model calibrated to multi-user microelectromechanical systems processes (MUMPS). The simulation model is calibrated to optical (buckling amplitude) and electrical (pull-in voltage) measurements concurrently, not independently, thus increasing confidence in the extracted parameters. A simulation-based model consisting of geometrical and material property information precludes the need for ad hoc parametric adjustments and simplifying assumptions. The calibration steps consist of identifying relevant simulation model parameters, designing suitable test structures, measuring geometry, then extracting parameters using detailed, yet fast electromechanical simulations, and finally extrapolating the behavior of an actual complex device. This article targets electrostatically actuated beams fabricated in the Poly1 layer, although the model parameters can be used to simulate other devices.
[1]
Weileun Fang,et al.
Post buckling of micromachined beams
,
1994
.
[2]
Raj K. Gupta,et al.
Electrostatic pull-in test structure design for in-situ mechanical property measurements of microelectromechanical systems (MEMS)
,
1997
.
[3]
R. Dutton,et al.
Characterization of contact electromechanics through capacitance-voltage measurements and simulations
,
1999
.
[4]
K. Petersen.
Dynamic micromechanics on silicon: Techniques and devices
,
1978,
IEEE Transactions on Electron Devices.
[5]
Timothy P. Weihs,et al.
Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films
,
1988
.