Electromigration Reliability and Morphologies of 62Sn–36Pb–2Ni and 62Sn–36Pb–2Cu Flip-Chip Solder Joints
暂无分享,去创建一个
Yi-Shao Lai | Chiu-Wen Lee | Y. Lai | C. Lee
[1] Yi-Shao Lai,et al. Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages , 2006, Microelectron. Reliab..
[2] Yi-Shao Lai,et al. Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
[3] J. O. Suh,et al. Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints , 2003 .
[4] Y. L. Lin,et al. Local melting induced by electromigration in flip-chip solder joints , 2006 .
[5] King-Ning Tu,et al. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization , 2003 .
[6] C. W. Lee,et al. A comparison of electromigration and thermal fatigue performance between thin and thick film UBM , 2003 .
[7] Y. Lai,et al. Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[8] S. W. Liang,et al. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes , 2006 .
[9] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .
[10] Y. Lai,et al. Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints , 2007 .
[11] Glenn A. Rinne. Issues in accelerated electromigration of solder bumps , 2003, Microelectron. Reliab..
[12] Yi-Shao Lai,et al. Characteristics of current crowding in flip-chip solder bumps , 2006, Microelectron. Reliab..
[13] Nickel-alloyed tin-lead eutectic solder for surface mount technology , 1993 .
[14] Yi-Shao Lai,et al. Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis , 2006 .
[15] Yi-Shao Lai,et al. Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects , 2007 .
[16] Yung-fu Chen,et al. Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads , 2004 .
[17] Hua Ye,et al. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing , 2003 .
[18] Y. Lai,et al. Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration , 2006 .
[19] Yi-Shao Lai,et al. Thermomigration in SnPb composite flip chip solder joints , 2006 .
[20] In-situ observation of material migration in flip-chip solder joints under current stressing , 2006 .
[21] S. Yeh. Copper doped eutectic tin-lead bump for power flip chip applications , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[22] J. J. Lee,et al. A study in flip-chip UBM/bump reliability with effects of SnPb solder composition , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..