First-principles calculations of elastic properties of Cu3Sn superstructure

We report the elastic properties of Cu3Sn superstructure based on first-principles calculations. Polycrystalline Young’s modulus and Poisson’s ratio are deduced from the calculated elastic stiffness. The calculations of electronic structures with the principal strains along different directions unravel the electronic nature of anisotropic elasticity of Cu3Sn. Weak Sn–Cu bonding in Cu3Sn suggests that Sn atoms are the dominant diffusion species, revealing the mechanism of vacancy formation within the Cu3Sn superstructure.

[1]  Hafner,et al.  Ab initio molecular-dynamics simulation of the liquid-metal-amorphous-semiconductor transition in germanium. , 1994, Physical review. B, Condensed matter.

[2]  Jyh-Wei Lee,et al.  The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump , 2004 .

[3]  Richard P. Vinci,et al.  Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints , 2003 .

[4]  Robert W. Messler,et al.  Microstructure evolution of eutectic Sn-Ag solder joints , 1994 .

[5]  G. Kresse,et al.  Ab initio molecular dynamics for liquid metals. , 1993 .

[6]  J. D. Bernal The Complex Structure of the Copper–Tin Intermetallic Compounds , 1928, Nature.

[7]  Kazuaki Ano,et al.  Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability , 2005 .

[8]  Olle Eriksson,et al.  Density functional theory for calculation of elastic properties of orthorhombic crystals: Application to TiSi2 , 1998 .

[9]  H. Iwasaki,et al.  Lattice modulation in the long-period superstructure of Cu3Sn , 1983 .

[10]  Burke,et al.  Generalized Gradient Approximation Made Simple. , 1996, Physical review letters.

[11]  A. Baron,et al.  Self-diffusion of Sn atoms inCu3Snprobed by quasielastic nuclear resonant scattering of synchrotron radiation , 2003 .

[12]  King-Ning Tu,et al.  Kinetics of interfacial reaction in bimetallic CuSn thin films , 1982 .

[13]  Nikhilesh Chawla,et al.  Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation , 2004 .

[14]  R. Hill The Elastic Behaviour of a Crystalline Aggregate , 1952 .

[15]  King-Ning Tu,et al.  Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu , 2007 .