Bibliography of Heat Transfer in Electronic Equipment

A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years.

[1]  G. Ellison,et al.  Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface , 1976 .

[2]  Analysis of thermal impedance for conventional and beam lead IC chips , 1971 .

[3]  G. Ellison.  The Thermal Design of an LSI Single-Chip Package , 1976 .

[4]  Sevgin Oktay,et al.  A conduction-cooled module for high-performance LSI devices , 1982 .

[5]  N. Goldberg,et al.  Narrow Channel Forced Air Heat Sink , 1984 .

[6]  Ephraim M Sparrow,et al.  Convective heat transfer response to height differences in an array of block-like electronic components , 1984 .

[7]  P. J. Marto,et al.  Pool Boiling Heat Transfer From Enhanced Surfaces to Dielectric Fluids , 1982 .

[8]  R. Hannemann,et al.  Electronic System Thermal Design for Reliability , 1977, IEEE Transactions on Reliability.

[9]  T. Steele.  Terminal and Cooling Requirements for LSI Packages , 1981 .

[10]  R. E. Simons.  Thermal management of electronic packages , 1983 .

[11]  William B. Murtha,et al.  Electronic Cooling Design and Test Validation , 1983 .

[12]  W. Engelmaier,et al.  Functional Cycles and Surface Mounting Attachment Reliability , 1985 .

[13]  R. Frieser,et al.  Heat Transfer of Modified Silicon Surfaces , 1980 .

[14]  T. Lewis,et al.  VLSI Thermal Management in Cost Driven Systems , 1982 .

[15]  D. W. Van de Pol,et al.  Free Convection Heat Transfer from Vertical Fin-Arrays , 1974 .

[16]  B Marandet,et al.  Experimental Verification of the J Ic and Equivalent Energy Methods for the Evaluation of the Fracture Toughness of Steels , 1977 .

[17]  E. Sasaki,et al.  Gas Cooling Enhancement Technology for Integrated Circuit Chips , 1984 .

[18]  M. Kohara,et al.  High Thermal Conduction Package Technology for Flip Chip Devices , 1983 .

[19]  A. Bar-Cohen,et al.  Convective Immersion Cooling of Parallel Vertical Plates , 1985 .

[20]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[21]  Suhas V. Patankar,et al.  Analysis of laminar mixed convection in shrouded arrays of heated rectangular blocks , 1985 .

[22]  James Kolodzey,et al.  CRAY-1 Computer Technology , 1981 .

[23]  R. Kilburn,et al.  Evaluation of surface heat transfer coefficients for electronic module packages , 1981 .

[24]  John R. Lapinski.  Analytical Investigation of Junction Temperatures for a Pulsed GaAs Laser , 1983 .

[25]  Ephraim M Sparrow,et al.  Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .

[26]  H. T. Nagle,et al.  Computer-Aided Thermal Anlaysis of a Hybrid Mutlistage Active Bandpass Filter/Amplifier , 1976 .

[27]  A. M. Kiper.  Impinging water jet cooling of VLSI circuits , 1984 .

[28]  D.L. Blackburn,et al.  Thermal characterization of power transistors , 1976, IEEE Transactions on Electron Devices.

[29]  Allan D. Kraus,et al.  Thermal Analysis and Control of Electronic Equipment , 1983 .

[30]  N. Ashiwake,et al.  Forced Convectiv Heat Transfer from LSI Packages in an Air-Cooled Wiring Card Array , 1988 .

[31]  Gene K. Baxter.  A Recommendation of Thermal Measurement Techniques for IC Chips and Packages , 1977, 15th International Reliability Physics Symposium.

[32]  K. Manchester,et al.  Thermal Resistance: A Reliability Consideration , 1980 .

[33]  Alan Bernath,et al.  Heat Transfer Measurements On Unequally Loaded Underground Power Cables With Constant And Cyclic Currents , 1984, IEEE Transactions on Power Apparatus and Systems.

[34]  J. Andrews,et al.  Thermal Characteristics of 16- and 40-Pin Plastic DIP's , 1981 .

[35]  D. Waller,et al.  Analysis of Surface Mount Thermal and Thermal Stress Performance , 1983 .

[36]  Allie M. Smith,et al.  General Expressions for Circular Constriction Resistances for Arbitrary Flux Distribution , 1976 .

[37]  R. B. Praught.  Inclined Fins for a More Efficient Heat Sink , 1982, INTELEC '82 - International Telecommunications Energy Conference.

[38]  Carl R. Zimmer.  Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects , 1983 .

[39]  J. Kallis,et al.  Nondestructive Infrared Inspection of Hybrid Microcircuit Substrate-to-Package Thermal Adhesive Bonds , 1981 .

[40]  W. Rohsenow,et al.  Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates , 1984 .

[41]  David Finch,et al.  The thermal management of printed circuit board assemblies , 1982 .

[42]  L. Mahalingam,et al.  Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits , 1983 .

[43]  E. Baker,et al.  Liquid cooling of microelectronic devices by free and forced convection , 1972 .

[44]  E. Baker,et al.  Liquid immersion cooling of small electronic devices , 1973 .

[45]  Allan W. Scott.  Cooling of electronic equipment , 1974 .

[46]  E. C. Blackburn.  VLSI packaging reliability , 1984 .

[47]  W. Aung,et al.  Free Convection Cooling of Electronic Systems , 1973 .

[48]  R. C. Chu,et al.  Conduction cooling for an LSI package: a one-dimensional approach , 1982 .

[49]  F. K. Moghadam.  Development of adhesive die attach technology in cerdip packages, material issues , 1984 .

[50]  R. P. Stout,et al.  True Temperature Measurement of Electronic Components Using Infra‐red Thermography , 1986 .

[51]  H. Berg,et al.  Thermal Studies of a Plastic Dual-in-Line Package , 1979 .

[52]  E. Sparrow,et al.  Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components , 1983 .

[53]  Ch. Zimmer.  VERSATILE PACKAGING CONCEPT USING THICK FILM HYBRIDS FOR ANALOG AND DIGITAL CIRCUITS , 1983 .

[54]  J. Kallis,et al.  Experimental Investigation of Mounting Thermal Resistance of Flatpacks on Circuit Boards , 1979 .

[55]  R. Flack,et al.  Heat Transfer Correlatins for Use in Naturally Cooled Enclosures with High-Power Integrated Circuits , 1980 .

[56]  R. Keyes.  Heat transfer in forced convection through fins , 1984, IEEE Transactions on Electron Devices.

[57]  W. Campo,et al.  Prediction of Component Temperatures on Circuit Cards Cooled by Natural Convection , 1982 .

[58]  M. Buller.  Thermal Transients in Electronic Packages , 1980 .

[59]  A. Bar-Cohen.  Thermal Design of Immersion Cooling Modules for Electronic Components , 1983 .

[60]  R. D. Johnson.  The cooling of electrical and electronic equipment in sealed enclosures , 1983 .

[61]  G. L. Kaiser.  Thermal management of the Standard Electronic Module /SEM/ , 1977 .