Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration
暂无分享,去创建一个
Hsiu-Ping Wei | Bongtae Han | Byeng D. Youn | Hyunseok Oh | B. Youn | B. Han | H. Oh | Hsiu-Ping Wei
[1] A. O'Hagan,et al. Bayesian calibration of computer models , 2001 .
[2] James O. Berger,et al. A Bayesian analysis of the thermal challenge problem , 2008 .
[3] Ronald G. Filippi,et al. The electromigration short‐length effect in Ti‐AlCu‐Ti metallization with tungsten studs , 1995 .
[4] Mei-Ling Wu. Assessing the impact of uncertainty in physics-of-Failure analysis of microelectronics damage , 2012 .
[5] J. Chauvineau,et al. Thin Films: Interdiffusion and Reactions, J.M. Poate, K.N. Tu, J.W. Mayer (Eds.). Wiley-Interscience, New York, N.Y. (1978) , 1979 .
[6] D. Stewart Peck,et al. Comprehensive Model for Humidity Testing Correlation , 1986, IEEE International Reliability Physics Symposium.
[7] Hans Janssen,et al. Monte-Carlo based uncertainty analysis: Sampling efficiency and sampling convergence , 2013, Reliab. Eng. Syst. Saf..
[8] M. Pecht,et al. Failure mechanisms of ball bearings under lightly loaded, non-accelerated usage conditions , 2015 .
[9] Dawn An,et al. Uncertainty analysis of solder alloy material parameters estimation based on model calibration method , 2012, Microelectron. Reliab..
[10] J. K. Spelt,et al. An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2—Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders , 2007, IEEE Transactions on Advanced Packaging.
[11] W. C. Leong,et al. Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[12] Douglas C. Montgomery,et al. Response Surface Methodology: Process and Product Optimization Using Designed Experiments , 1995 .
[13] B. Youn,et al. Eigenvector dimension reduction (EDR) method for sensitivity-free probability analysis , 2008 .
[14] J. Bert Keats,et al. Statistical Methods for Reliability Data , 1999 .
[15] Sang Bum Kim,et al. A hierarchical framework for statistical model calibration in engineering product development , 2011 .
[16] S. Manson. Behavior of materials under conditions of thermal stress , 1953 .
[17] G. Q. Zhang,et al. Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach , 2004, Microelectron. Reliab..
[18] Ying Xiong,et al. A better understanding of model updating strategies in validating engineering models , 2009 .
[19] Chris Bailey,et al. Modelling the fatigue life of solder joints for surface mount resistors , 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
[20] P. L Hall,et al. Probabilistic physics-of-failure models for component reliabilities using Monte Carlo simulation and Weibull analysis: a parametric study , 2003, Reliab. Eng. Syst. Saf..
[21] S. Rahman,et al. A univariate dimension-reduction method for multi-dimensional integration in stochastic mechanics , 2004 .
[22] Bongtae Han,et al. Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review , 2015, IEEE Transactions on Power Electronics.
[23] Byeng D. Youn,et al. An empirical model to describe performance degradation for warranty abuse detection in portable electronics , 2015, Reliab. Eng. Syst. Saf..
[24] Bongtae Han,et al. Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu , 2014 .
[25] Jafar Razmi,et al. Probabilistic Design Approach for Cyclic Fatigue Life Prediction of Microelectronic Interconnects , 2010, IEEE Transactions on Advanced Packaging.
[26] Josse De Baerdemaeker,et al. Computational fluid dynamics modelling and validation of the temperature distribution in a forced convection oven , 2000 .
[27] M. Pecht,et al. Reliability of gull-wing and leadless packages subjected to temperature cycling after rework , 2012, IEEE Transactions on Device and Materials Reliability.
[28] John W. Evans,et al. Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method , 2000 .
[29] K. Kang,et al. Probabilistic analysis for mechanical properties of glass/epoxy composites using homogenization method and Monte Carlo simulation , 2014 .
[30] X. Wang,et al. Temperature dependent time-to-breakdown (TBD) of TiN/HfO2 n-channel MOS devices in inversion , 2009, Microelectron. Reliab..
[31] Guo-Quan Lu,et al. Effects of solder joint shape and height on thermal fatigue lifetime , 2003 .
[32] Mohammad Modarres,et al. A probabilistic physics-of-failure model for prognostic health management of structures subject to pitting and corrosion-fatigue , 2011, Reliab. Eng. Syst. Saf..
[33] Michael Pecht,et al. Assessing time-to-failure due to conductive filament formation in multi-layer organic laminates , 1994 .
[34] Laura Painton Swiler,et al. Calibration, validation, and sensitivity analysis: What's what , 2006, Reliab. Eng. Syst. Saf..