Mosaic placement of very high density 3D capacitors for efficient decoupling functionality in the RF domain

In this paper, we present a layout driven approach used to fill empty space within MCM, with 3D high density decoupling capacitors. In a first time, a description of the innovative 3D unit cell is done based on process considerations. Then the method including the whole design flow is described and validated with the help of specific test cases and RF characterization data up to 6 GHz. A physical model is also proposed and implemented in the flow. The correlation between measurements and simulation data is found satisfactory and allows validating the proposed approach.

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