A Compact Coupled Inductor for Interleaved Multiphase DC–DC Converters
暂无分享,去创建一个
[1] Fred C. Lee,et al. High-Density Integration of High-Frequency High-Current Point-of-Load (POL) Modules With Planar Inductors , 2015, IEEE Transactions on Power Electronics.
[2] F.C. Lee,et al. Twisted Core Coupled Inductors for Microprocessor Voltage Regulators , 2007, 2007 IEEE Power Electronics Specialists Conference.
[3] Charles R. Sullivan,et al. Coupled-inductor design optimization for fast-response low-voltage DC-DC converters , 2002, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335).
[4] Fred C. Lee,et al. Design and Evaluation of a High-Frequency LTCC Inductor Substrate for a Three-Dimensional Integrated DC/DC Converter , 2013, IEEE Transactions on Power Electronics.
[5] Fred C. Lee,et al. High frequency integrated Point of Load (POL) module with PCB embedded inductor substrate , 2013, 2013 IEEE Energy Conversion Congress and Exposition.
[6] Peng Xu,et al. Performance improvements of interleaving VRMs with coupling inductors , 2001 .
[7] Brad Lehman,et al. Analysis and Verification of Inductor Coupling Effect in Interleaved Multiphase dc–dc Converters , 2016, IEEE Transactions on Power Electronics.
[8] Peng Xu,et al. Investigation of candidate VRM topologies for future microprocessors , 2000 .
[9] Brad Lehman,et al. Mitigation and utilization of the inductor coupling effect in interleaved multiphase DC/DC converters , 2013, 2013 IEEE Energy Conversion Congress and Exposition.
[10] Qiang Li. Low-Profile Magnetic Integration for High-Frequency Point-of-Load Converter , 2011 .
[11] Yipeng Su. High Frequency, High Current 3D Integrated Point-of-Load Module , 2015 .
[12] Qiang Li,et al. High-Density Low-Profile Coupled Inductor Design for Integrated Point-of-Load Converters , 2013, IEEE Transactions on Power Electronics.