The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering
暂无分享,去创建一个
C. C. Chang | C. Kao | Y. W. Lin | C. R. Kao | Yun-Hsin Wang | Yun-Hsin Wang | C. C. Chang
[1] C. Kao,et al. Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth , 2009 .
[2] King-Ning Tu,et al. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu , 1995 .
[3] C. Handwerker,et al. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys , 2000 .
[4] Y. C. Chan,et al. Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering , 2005 .
[5] Yee-Wen Yen,et al. Interfacial reactions in Ag-Sn/Cu couples , 1999 .
[6] Chang-Da Tsai,et al. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni , 2003 .
[7] Y. Chang,et al. Reactions of solid copper with pure liquid tin and liquid tin saturated with copper , 1997 .
[8] C. Kao. Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples , 1997 .
[9] I. Anderson,et al. A viable tin-lead solder substitute: Sn-Ag-Cu , 1994 .
[10] D. Frear,et al. Pb-free solders for flip-chip interconnects , 2001 .
[11] P. G Boswell,et al. Crystallisation of an Mg74Zn26 glass , 1978 .
[12] Li Wang,et al. Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method , 2005 .
[13] Albert Feldman,et al. Thermal and electrical properties of copper‐tin and nickel‐tin intermetallics , 1992 .
[14] C. Kao,et al. Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu , 2006 .
[15] Xin Ma,et al. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface , 2003 .
[16] K. N. Subramanian,et al. Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging , 1999 .
[17] L. Snugovsky,et al. Experiments on interaction of liquid tin with solid copper , 2003 .
[18] C. Kao,et al. Interfacial reaction issues for lead-free electronic solders , 2006 .
[19] Y. C. Chan,et al. Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging , 2005 .
[20] Y. Chan,et al. Effect of 0.5 wt % Cu addition in Sn–3.5%Ag solder on the dissolution rate of Cu metallization , 2003 .
[21] Yi-Wun Wang,et al. Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates , 2009, Microelectron. Reliab..
[22] Chien W. Chang,et al. Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness , 2007 .
[23] K. Tu,et al. Tin–lead (SnPb) solder reaction in flip chip technology , 2001 .
[24] Won Kyoung Choi,et al. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate , 2000 .
[25] K. Bae,et al. Interdiffusion analysis of the soldering reactions in Sn-3.5Ag/Cu couples , 2001 .
[26] Wenge Yang,et al. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints , 1995 .
[27] King-Ning Tu,et al. Rate of consumption of Cu in soldering accompanied by ripening , 1995 .
[28] C. Kao,et al. Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu , 2009 .
[29] King-Ning Tu,et al. Physics and materials challenges for lead-free solders , 2003 .
[30] H. Reichl,et al. Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders , 2005 .