Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings

Abstract Lab-on-a-chip (LOC) devices have enabled significant advancements in medical, biological, and chemical analysis. However, widespread adoption of these devices in, clinical settings and academic environments has been impeded by a lack of a reliable, adaptable, and easy-to-use packaging technology. In this work, we introduce a rapid, prototyped modular microfluidic interconnect that addresses these challenges of the, world-to-chip interface. The interconnect, a flexible polymer gasket co-printed with, rigid clamps, eliminates adhesives and additional assembly by direct multi-material 3D, printing from a computer-aided design model. The device represents the first, application of multi-material 3D printing to microfluidic interconnects, and it can be, rapidly re-designed and printed, and has demonstrated the ability to withstand, pressures exceeding 400 kPa.