论文信息 - Active “multi-fingers”: Test structure to improve MOSFET matching in sub-threshold area

Active “multi-fingers”: Test structure to improve MOSFET matching in sub-threshold area

Low power analog applications are often designed under threshold and can be degraded by hump effect. This effect is explained through device dimensions and body bias studies. A MOSFET matching improvement in sub-threshold area is demonstrated with active “multi-fingers” test structure.

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