Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure
暂无分享,去创建一个
Kuo-Ning Chiang | Chang-Chun Lee | Chin-Chiu Hsia | C. C. Chiu | H. H. Chang | C. Chiu | K. Chiang | C. C. Lee | H. Chang | C. Hsia
[1] Chee Lip Gan,et al. Adhesion Studies of Ta ∕ Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend , 2006 .
[2] J. R. Miller,et al. Global-local analysis of large-scale composite structures using finite element methods , 1996 .
[3] Xia Cai,et al. Research of Underfill Delamination in Flip Chip by the J-Integral Method , 2004 .
[4] J. Rice. A path-independent integral and the approximate analysis of strain , 1968 .
[5] Q. Ma,et al. A four-point bending technique for studying subcritical crack growth in thin films and at interfaces , 1997 .
[6] Zhigang Suo,et al. Initiation and arrest of an interfacial crack in a four-point bend test , 2005 .
[7] Zhong Chen,et al. Modification of Ta/polymeric low-k interface by electron-beam treatment , 2006 .
[8] S. Pozder,et al. Analysis of flip-chip packaging challenges on copper/low-k interconnects , 2003 .
[9] A. Evans,et al. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces , 1989 .