Sub-30 nm pitch line-space patterning of semiconductor and dielectric materials using directed self-assembly
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Sebastian Engelmann | Joy Cheng | Michael A. Guillorn | Chi-Chun Liu | J. J. Bucchignano | Nicholas C. M. Fuller | Hsinyu Tsai | Joy Y. Cheng | Hiroyuki Miyazoe | D. Klaus | M. Guillorn | N. Fuller | D. Klaus | J. Bucchignano | S. Engelmann | H. Miyazoe | B. To | H. Tsai | D. Sanders | E. Sikorski | Bang To | Ed S. Sikorski | Dan Sanders | Chi-Chun Liu
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