Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs

Abstract To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with thermoelectric cooler (TEC) is investigated. In the experiment, the 6 × 3 W LEDs in two rows are used to compose the light source module and the environment temperature is 17 °C. The temperatures of heat dissipation substrate of LEDs and cooling fins of a radiator are measured by K type thermocouples to evaluate the cooling performance. Results show that the temperature of the substrate of LEDs reaches 26 °C without TEC. However, it is only 9 °C when the best refrigeration condition appears. The temperature of the substrate of LEDs decreases by 17 °C since the heat produced by LEDs is absorbed rapidly by TEC and dissipated through the radiator, and the junction temperature of LEDs reaches only 45 °C which is much lower than the absolute maximum temperature of LEDs (120 °C). The experiment demonstrates that the cooling system with TEC has good performance.

[1]  Yongzhi He,et al.  Materials Challenges and Solutions for the Packaging of High Power LEDs , 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

[2]  Junhui Li,et al.  Observations on HRTEM features of thermosonic flip chip bonding interface , 2007 .

[3]  Junhui Li,et al.  Interface mechanism of ultrasonic flip chip bonding , 2007 .

[4]  Stephane F. Jacob Maximizing useful SSL lifetime , 2004, SPIE Optics + Photonics.

[5]  Nan Wang,et al.  Numerical study on thermal management of LED packaging by using thermoelectric cooling , 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

[6]  Hongda Chen,et al.  A new golden bump making method for high power LED flip chip , 2007, SPIE/COS Photonics Asia.

[7]  Brian C. Sales,et al.  Smaller Is Cooler , 2002, Science.

[8]  Xian-An Cao,et al.  High-power and reliable operation of vertical light-emitting diodes on bulk GaN , 2004 .

[9]  Yung Sheng Liu,et al.  Progress of solid state lighting technology in Taiwan , 2004, SPIE Optics + Photonics.

[10]  Changhong Wang,et al.  Thermal performance of heatsink and thermoelectric cooler packaging designs in LED , 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

[11]  Bin-Juine Huang,et al.  A design method of thermoelectric cooler , 2000 .

[12]  Sheng Liu,et al.  A microjet array cooling system for thermal management of active radars and high-brightness LEDs , 2006, 56th Electronic Components and Technology Conference 2006.

[13]  Kai Zhang,et al.  Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[14]  Junhui Li,et al.  Microstructural characteristics of Au/Al bonded interfaces , 2007 .

[15]  H. Reichl,et al.  Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering , 2002 .

[16]  Arvind Raman,et al.  Optimal design of miniature piezoelectric fans for cooling light emitting diodes , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[17]  Sheng Liu,et al.  A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs , 2007, IEEE Transactions on Advanced Packaging.

[18]  Vadim V. Silberschmidt,et al.  A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads , 2009 .

[19]  Ra-Min Tain,et al.  Cooling performance of silicon-based thermoelectric device on high power LED , 2005, ICT 2005. 24th International Conference on Thermoelectrics, 2005..

[20]  Alan Mills Solid state lighting — a world of expanding opportunities at LED 2002 , 2003 .

[21]  N. Narendran,et al.  Life of LED-based white light sources , 2005, Journal of Display Technology.

[22]  Paul S. Martin,et al.  Illumination with solid state lighting technology , 2002 .

[23]  Hong Qin,et al.  Thermal Performance Evaluation and Economic Analysis of LED Integrated with Thermoelectric Cooler Package , 2011 .