BEOL compatible graphene/Cu with improved electromigration lifetime for future interconnects
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Tao Wang | H.-S. Philip Wong | Alex Yoon | J. A. Currivan-Incorvia | H. Wong | Zhongwei Zhu | Zhongwei Zhu | Ling Li | Tao Wang | Ling Li | Jean A. Currivan-Incorvia | A. Yoon
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