Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials

A comprehensive review of analytical and empirical models for calculating the thermal conductance across mechanically formed joints is presented. A historical perspective of modeling procedures for a range of interface cone gurations is presented, including barecontacting surfaces for conforming rough surfaces aswell as interfacial surfaces augmented with enhancement materials such as greases, metallic foils, polymeric compliant materials, e lms, and coatings. Given the wide range of interface materials available and their associated thermophysical and surface properties, the models presented provide an effective procedure for determining the signie cance of these properties in the prediction of contact, gap, and overall joint conductance.

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