Power law indentation creep of Sn-5% Sb solder alloy

Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long time Vickers indentation testing at room temperature. Based on the steady-state power law creep relationship, the stress exponents were determined for the cast and wrought materials in the homogenized and unhomogenized conditions. The stress exponent values of 4.5 and 12, depending on the processing route of the material, are in good agreement with those reported for the same material in conventional creep testing at room temperature. The results are discussed on the basis of the microstructural features developed during different processing routes of the material.

[1]  Warren C. Oliver,et al.  Indentation power-law creep of high-purity indium , 1999 .

[2]  Paul T. Vianco,et al.  Issues in the replacement of lead-bearing solders , 1993 .

[3]  Terence G. Langdon,et al.  Identifiying creep mechanisms at low stresses , 2000 .

[4]  T. Kutty,et al.  Development of creep curves from hot indentation hardness data , 1996 .

[5]  F. M. Haggag,et al.  Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation , 1997 .

[6]  P. Adeva,et al.  Indentation creep of lead and lead-copper alloys , 1991, Journal of Materials Science.

[7]  H. Mavoori.  Dimensionally stable solders for optoelectronics and microelectronics , 2000 .

[8]  R. Mahmudi,et al.  Room temperature indentation creep of cast Pb–Sb alloys , 2004 .

[9]  R. Mahmudi,et al.  Indentation creep of antimonial lead alloys , 2003 .

[10]  M. Fujiwara,et al.  Indentation creep of β-Sn and Sn–Pb eutectic alloy , 2001 .

[11]  R. Mccabe,et al.  High creep resistance tin-based alloys for soldering applications , 2002 .

[12]  A. Juhász,et al.  Indentation test for the investigation of high-temperature plasticity of materials , 1997 .

[13]  Oleg D. Sherby,et al.  The Structure dependence of power law creep , 1982 .

[14]  R. Ramanujan,et al.  Hot hardness and indentation creep studies of a Fe–28Al–3Cr–0.2C alloy , 2000 .

[15]  R. Mahmudi,et al.  Investigation of stress exponent in the power-law creep of Pb–Sb alloys , 2004 .

[16]  R. Mccabe,et al.  Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin , 2002 .

[17]  Kazuya Miyahara,et al.  Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys , 2001 .