Constructal entransy dissipation minimization for ‘volume-point’ heat conduction
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By taking equivalent thermal resistance, which reflects the average heat
conduction effect and is defined based on entransy dissipation, as
optimization objective, the “volume to point” constructal problem based on
triangular element of how to discharge the heat generated in a fixed volume
to a heat sink on the border through relatively high conductive link is
re-analyzed and re-optimized in this paper. The constructal shape of the
control volume with the best average heat conduction effect is deduced. For
the same parameters, the constructs based on minimization of entransy
dissipation and the constructs based on minimization of maximum temperature
difference are compared, and the results show that the constructs based on
entransy dissipation can decrease the mean temperature difference better than
the constructs based on minimization of maximum temperature difference. But
with the increase of the number of order, the mean temperature difference
does not always decrease, and there exists some fluctuations. Because the
idea of entransy describes heat transfer ability more suitably, the
optimization results of this paper can be put to engineering application of
electronic cooling.