Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers
暂无分享,去创建一个
A. Witvrouw | R. Reichenbach | F. Laermer | H. Stahl | A. Hoechst | F. Fischer | L. Metzger | S. Kronmueller | K. Breitschwerdt | R. Gunn | S. Watcham | C. Rusu
[1] T. Kenny,et al. New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).
[2] Toshiyuki Tsuchiya,et al. Polysilicon vibrating gyroscope vacuum-encapsulated in an on-chip micro chamber , 2001 .
[3] R. Howe,et al. Vacuum encapsulation of resonant devices using permeable polysilicon , 1999, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291).
[4] Jiri Dr Ing Dr Marek,et al. Acceleration Sensor in Surface Micromachining for Airbag Applications with High Signal/Noise Ratio , 1996 .