Interactions between lead oxide and ceramic substrates for thick film technology

We investigated the interactions between screen printed and fired layers of Bi 2 O 3 and ceramic substrates of alumina and beryllia. It was found that the reaction products are invariably crystalline in nature. Several transitions of Bi 2 O 3 in its polymorphic phases were found to occur on BeO substrates, while newly formed compounds have been observed to grow on alumina substrates, i.e., Al 4 Bi 2 O 9 on 99.9% Al 2 O 3 and Bi 12 SiO 20 on 96% Al 2 O 3 . Bismuth deeply penetrates in the ceramic interstices in all the cases. Until Bi 2 O 3 is not completely reacted, this penetration is diffusion limited (penetration depth , where t d is the reaction time) with values of the activation energy ranging from 3.7 ± 0.6 eV (BeO substrate) to 1.4 ± 0.06 eV (96% Al 2 O 3 substrate). It is shown that these processes are notably different to those occurring in PbO/ceramic systems; moreover, they imply different adhesion phenomena of thick films on different substrates.

[1]  M. E. Twentyman High-temperature metallizing , 1975 .

[2]  Roydn D. Jones Hybrid circuit design and manufacture , 1982 .

[3]  U. Gösele,et al.  Mechanisms of doping‐enhanced superlattice disordering and of gallium self‐diffusion in GaAs , 1988 .

[4]  M. Kohyama,et al.  Electronic Structure and Chemical Reactions at Metal–Alumina and Metal–Aluminum Nitride Interfaces , 1991 .

[5]  P. Holmes,et al.  Handbook of thick film technology , 1976 .

[6]  A. S. Grove Physics and Technology of Semiconductor Devices , 1967 .

[7]  D. Tréheux,et al.  Study of copper-alumina bonding , 1986 .

[8]  E. N. Bunting,et al.  Report on the systems lead oxide-alumina and lead oxide-alumina-silica , 1943 .

[9]  M. Prudenziati,et al.  Powder X-ray diffraction data for the new polymorphic compound ω-Bi2O3 , 1997, Powder Diffraction.

[10]  S. Pepper Shear strength of metal‐sapphire contacts , 1976 .

[11]  Bruno Morten,et al.  EVOLUTION OF THE MICROSTRUCTURE AND PERFORMANCE OF Pd/Ag- BASED THICK CONDUCTORS , 1985 .

[12]  G. Liptay Atlas of thermoanalytical curves , 1971 .

[13]  S. Cole,et al.  Glass‐Migration Mechanism of Ceramic‐to‐Metal Seal Adherence , 1961 .

[14]  C. Peden,et al.  Metal/metal‐oxide interfaces: A surface science approach to the study of adhesion , 1991 .

[15]  C. Sorrell PbO Transformation Induced by Water , 1972 .

[16]  J. Gibbons,et al.  Diffusion and electrical properties of silicon‐doped gallium arsenide , 1985 .

[17]  A. S. Grove,et al.  General Relationship for the Thermal Oxidation of Silicon , 1965 .

[18]  G. Gattow,et al.  Über Wismutoxide. III. Die Kristallstruktur der Hochtemperaturmodifikation von Wismut(III)‐oxid (δ‐Bi2O3) , 1962 .

[19]  Maria Prudenziati,et al.  Interactions between alumina and high lead glasses for hybrid components , 1989 .