Accurate predictions of flip chip BGA warpage
暂无分享,去创建一个
[1] D. Love,et al. Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[2] Shijian Luo,et al. Surface property of passivation and solder mask for flip chip packaging , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[3] X.Q. Shi,et al. Modeling interface fracture in flip chip assembly , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[4] S. Jakschik,et al. Mechanism and growth rate of underfill delaminations in flip chips , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[5] S. Tsai,et al. Introduction to composite materials , 1980 .
[6] Donald R. Banks,et al. Thermal Cycling Effects on Eutectic Flip-Chip Die on Organic Packages , 2000 .
[7] Yuan Li,et al. Reliability study of high-pin-count flip-chip BGA , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[8] T. Ono,et al. Design method for high reliable flip chip BGA package , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).