3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation
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Jih-Sheng Lai | John Reichl | Allen Hefner | J. Lai | A. Hefner | Jose M. Ortiz-Rodriguez | J. Reichl | J. M. Ortiz-Rodríguez
[1] J. Lai,et al. High speed thermal coupling measurements for multichip electro-thermal model validation , 2013, 2013 IEEE 14th Workshop on Control and Modeling for Power Electronics (COMPEL).
[2] Jih-Sheng Lai,et al. Variable Timing Control for Wide Current Range Zero-Voltage Soft-Switching Inverters , 2009, 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition.
[3] E. Santi,et al. Expanded Thermal Model for IGBT Modules , 2006, Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.
[4] A. Hefner,et al. Thermal component models for electro-thermal network simulations , 1993 .
[5] Johan Driesen,et al. Optimal Control of Traction Motor Drives Under Electrothermal Constraints , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.
[6] C. Ellenwood,et al. High speed IGBT module transient thermal response measurements for model validation , 2003, 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003..
[7] Yasushi Yamada,et al. Novel Electro-Thermal Coupling Simulation Technique for Dynamic Analysis of HV (Hybrid Vehicle) Inverter , 2006 .
[8] Rafik Neji,et al. Thermal behavior of a three phase inverter for EV (Electric Vehicle) , 2010, Melecon 2010 - 2010 15th IEEE Mediterranean Electrotechnical Conference.
[9] Dritan Celo,et al. Compact, netlist-based representation of thermal transient coupling using controlled sources , 2004, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[10] Ashwin M. Khambadkone,et al. Dynamic electro-thermal modeling in Power Electronics Building Block (PEBB) applications , 2010, 2010 IEEE Energy Conversion Congress and Exposition.
[11] M. Alakula,et al. Electro-thermal simulations of a power electronic inverter for a hybrid car , 2011, 2011 IEEE International Electric Machines & Drives Conference (IEMDC).
[12] F. Profumo,et al. Analysis of the electro-thermal behaviour of multichip power modules , 1998, Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242).
[13] A. Castellazzi,et al. Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions , 2006, IEEE Transactions on Power Electronics.
[14] S. Lindenkreuz,et al. Fully coupled dynamic electro-thermal simulation , 1997, IEEE Trans. Very Large Scale Integr. Syst..
[15] T. Ueta,et al. A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module , 2012, IEEE Transactions on Power Electronics.
[16] J. S. Brodsky,et al. Equivalent circuit modeling of static substrate thermal coupling using VCVS representation , 2002, IEEE J. Solid State Circuits.
[17] Janusz Zarebski,et al. The Method of a Fast Electrothermal Transient Analysis of Single-Inductance DC–DC Converters , 2012, IEEE Transactions on Power Electronics.
[18] M. Ciappa,et al. Multi-level electro-thermal modeling for circuit simulation of packaged power devices , 2008, 2008 11th Workshop on Control and Modeling for Power Electronics.
[19] T. Kojima,et al. Novel RC Compact Thermal Model of HV Inverter Module for Electro-Thermal Coupling Simulation , 2007, 2007 Power Conversion Conference - Nagoya.
[20] Bin Du,et al. Transient Electrothermal Simulation of Power Semiconductor Devices , 2010, IEEE Transactions on Power Electronics.
[21] Phil Mawby,et al. Fast Thermal Models for Power Device Packaging , 2008, 2008 IEEE Industry Applications Society Annual Meeting.
[22] Wolfgang Fichtner,et al. Thermal component model for electrothermal analysis of IGBT module systems , 2001 .
[23] E. Dallago,et al. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. II. Practice and experiments , 1998 .
[24] Y. Çengel. Heat and Mass Transfer: Fundamentals and Applications , 2000 .
[25] T. Ueta,et al. A Fast Loss and Temperature Simulation Method for Power Converters, Part I: Electrothermal Modeling and Validation , 2012, IEEE Transactions on Power Electronics.
[26] C. M. Johnson,et al. Automated Fast Extraction of Compact Thermal Models for Power Electronic Modules , 2013, IEEE Transactions on Power Electronics.
[27] Frank P. Incropera,et al. Fundamentals of Heat and Mass Transfer , 1981 .
[28] E. Dallago,et al. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory , 1998 .
[29] M. Velez-Reyes,et al. Thermal component models for electro thermal analysis of multichip power modules , 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).