Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

[1]  M. Inoue,et al.  Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder , 2007 .

[2]  Katsuaki Suganuma,et al.  Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate , 2005 .

[3]  K. S. Kim,et al.  Isothermal aging characteristics of Sn-Pb micro solder bumps , 2003, Microelectron. Reliab..

[4]  K. S. Kim,et al.  Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu , 2003, Microelectron. Reliab..

[5]  King-Ning Tu,et al.  Kinetic theory of flux-driven ripening , 2002 .

[6]  Hyuck-Mo Lee,et al.  A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system , 2002 .

[7]  R. K. Shiue,et al.  Effect of solder creep on the reliability of large area die attachment , 2001, Microelectron. Reliab..

[8]  D. Frear,et al.  Wetting reaction versus solid state aging of eutectic SnPb on Cu , 2001 .

[9]  Yoshiyuki Nagatomo,et al.  FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules , 2000 .

[10]  Katsuaki Suganuma,et al.  Heat resistance of Sn-9Zn solder/Cu interface with or without coating , 2000 .

[11]  K. Ishida,et al.  Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use , 1999 .

[12]  Koichi Niihara,et al.  Wetting and interface microstructure between Sn–Zn binary alloys and Cu , 1998 .

[13]  K. Tu,et al.  Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition , 1998 .

[14]  C. Kao.  Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples , 1997 .

[15]  Hyuck-Mo Lee,et al.  Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation , 1997 .

[16]  Seung Wook Yoon,et al.  Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system , 1997 .

[17]  Kim,et al.  Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. , 1996, Physical review. B, Condensed matter.

[18]  K. Suganuma.  Advances in lead-free electronics soldering , 2001 .