Adhesion strength of die attach film for thin electronic package at elevated temperature

Abstract Adhesion strength of a thin film for electronic packaging was investigated. The effects of temperature and loading rate on the adhesion were observed considering the viscoelasticity of adhesive. Various temperature conditions over the glass transition temperature of the adhesive were applied with controlled loading rates. A small hot plate was specially designed to control the temperature. Loading rate was controlled by a servo motor. A cantilever specimen was fabricated by two rectangular silicon chips. The adhesion was measured by a modified single cantilever beam method. Bending force was applied to the cantilever using rotatable jig. Adhesion strength was found to strongly depend on the temperature and loading rate. Below the glass transition temperature (Tg), the adhesion strength was increased with increasing loading rate. Near the Tg, the adhesion strength was decreased with increasing loading rate. Above the Tg, the adhesion strength did not significantly depend on the loading rate.

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