论文信息 - Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system - 字舞流文

Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system

K. Suganuma | Y. Tsukada | K. Yamanaka

[1] K. Puttlitz,et al. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies , 2004 .

[2] King-Ning Tu,et al. Electromigration in eutectic SnPb solder lines , 2001 .

[3] K. Tu,et al. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes , 1999 .

[4] P. Ho,et al. Electromigration in Metals , 1989 .

[5] I. Blech. Electromigration in thin aluminum films on titanium nitride , 1976 .

[6] A. Nowick,et al. Diffusion in solids: recent developments , 1975 .

[7] H. B. Huntington. 6 – Electromigration in Metals , 1975 .