Vce as early indicator of IGBT module failure mode

A double point monitoring concept of the on-state voltage is presented as a means to identify the failure mode early in a power module lifetime. The monitoring approach is carried out in a simple accelerated test setup, however, it is argued that the concepts should be possible in field. Additionally, by carrying out the monitoring in calibration conditions it is shown that it is possible to identify the fracture rate of the bond wire fatigue failure mechanism. The curve shape of the degradation rate is in accordance with expected fracture theory.

[1]  Pramod Ghimire,et al.  Monitoring of IGBT modules - temperature and degradation simulation , 2016 .

[2]  Kristian Bonderup Pedersen,et al.  Dynamic Modeling Method of Electro-Thermo-Mechanical Degradation in IGBT Modules , 2016, IEEE Transactions on Power Electronics.

[3]  Josef Lutz,et al.  Semiconductor Power Devices , 2011 .

[4]  Josef Lutz,et al.  Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime , 2008 .

[5]  Kristian Bonderup Pedersen,et al.  Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules , 2014, Journal of Materials Science: Materials in Electronics.

[6]  Gerard Coquery,et al.  Investigation of the heel crack mechanism in Al connections for power electronics modules , 2011, Microelectron. Reliab..

[7]  Klaus-Dieter Lang,et al.  Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law , 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

[8]  Herbert Reichl,et al.  Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires , 2006 .

[9]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[10]  Frédéric Richardeau,et al.  Evaluation of $V_{\rm ce}$ Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling , 2013, IEEE Transactions on Industrial Electronics.

[11]  Claus-Peter Fritzen,et al.  Modelling of short crack propagation – Transition from stage I to stage II , 2008 .

[12]  Kjeld Pedersen,et al.  Degradation Assessment in IGBT Modules Using Four-Point Probing Approach , 2015, IEEE Transactions on Power Electronics.

[13]  W. J. Plumbridge,et al.  Review: Fatigue-crack propagation in metallic and polymeric materials , 1972 .

[14]  G. Nicoletti,et al.  Fast power cycling test of IGBT modules in traction application , 1997, Proceedings of Second International Conference on Power Electronics and Drive Systems.

[15]  Mads Brincker,et al.  Passive thermal cycling of power diodes under controlled atmospheric conditions - effects on metallization degradation , 2016 .

[16]  Li Yang,et al.  Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling , 2011, Microelectron. Reliab..