论文信息 - Diffusion Barriers Between Al and Cu for the Cu Interconnect of Memory Devices - 字舞流文

Diffusion Barriers Between Al and Cu for the Cu Interconnect of Memory Devices

Ki-Bum Kim | H. Sohn | Soo‐Hyun Kim | Hyun-Mi Kim | Ki-Su Kim | Do-Joong Lee | Sung-Soo Yim | Do‐Joong Lee