3축 로봇을 이용한 LED 디스펜싱 공정 성능 개선

LED’s production does Die bonding and Wire bonding on L/F board, and do epoxy dispensing to protect LED Chip and improve brightness. In this paper, we propose and realize a mechanism detecting automatically eopxy’s amount being filled, control data of pressure and time by the Quantity automatic revision, and epoxy of the schedule amount dispensing.