Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
暂无分享,去创建一个
Guo-Quan Lu | G. Lu | Z. Zhang | Z. Zhang
[1] H. Schwarzbauer,et al. Novel large area joining technique for improved power device performance , 1989, Conference Record of the IEEE Industry Applications Society Annual Meeting,.
[2] M. C. Shaw,et al. Thermomechatronics of power electronic packages , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
[3] N. Zhu,et al. Thermal impact of solder voids in the electronic packaging of power devices , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).
[4] J.D. van Wyk,et al. Void induced thermal impedance in power semiconductor modules: some transient temperature effects , 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).
[5] S. Klaka,et al. Reduction of thermomechanical stress by applying a low temperature joining technique , 1994, Proceedings of the 6th International Symposium on Power Semiconductor Devices and Ics.
[6] R. J. Jenkins,et al. Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity , 1961 .