Anomalous effects on the current‐voltage characteristics of p‐channel metal‐oxide‐semiconductor transistors in the temperature range 4.2–50 K

The current‐voltage characteristics of p‐channel MOSFETs (metal‐oxide‐semiconductor field‐effect transistors) in the temperature range 4.2‐50 K have been investigated in detail. A peak is observed at the beginning of the drain‐current–drain‐voltage (Id, Vd) curves for low Vg values, which is not observed in the case of n‐channel MOSFETs and is found to be a very slow transient effect. This time‐dependent peak is observed for temperatures below ∼25 K and for channel lengths greater than ∼3 μm. In this temperature range a strong hysteresis effect is also observed at low Vg voltages. The above behavior will be explained in terms of a very slow depletion layer formation in the drain region, introduced by the large time constant of the field‐assisted thermal emission of carriers in n‐type bulk semiconductors at temperatures below ∼20 K. Another effect, analogous to the ‘‘kink effect’’ observed in n‐channel MOSFETs at temperatures below 16 K, is also observed for low Vg and Vd values. This effect is observed wi...

[1]  B. Lengeler,et al.  Semiconductor devices suitable for use in cryogenic environments , 1974 .

[2]  R.L. Maddox p-MOSFET parameters at cryogenic temperatures , 1976, IEEE Transactions on Electron Devices.

[3]  V. L. Rideout,et al.  Very small MOSFET's for low-temperature operation , 1977, IEEE Transactions on Electron Devices.

[4]  G. Goto,et al.  Gunn-effect logic device using transverse extension of a high field domain , 1976, IEEE Transactions on Electron Devices.

[5]  R. Jaeger,et al.  Simulation of impurity freezeout through numerical solution of Poisson's equation with application to MOS device behavior , 1980, IEEE Transactions on Electron Devices.

[6]  E. Rosencher,et al.  Transient-current study of field-assisted emission from shallow levels in silicon , 1984 .

[7]  D. Foty,et al.  Thermal effects in n-channel enhancement MOSFET's operated at cryogenic temperatures , 1987, IEEE Transactions on Electron Devices.

[8]  J. Tihanyi,et al.  Influence of the floating substrate potential on the characteristics of ESFI MOS transistors , 1975 .

[9]  P. U. Calzolari,et al.  Field-enhanced carrier generation in MOS capacitors , 1974 .

[10]  Francis Balestra,et al.  Influence of substrate freeze-out on the characteristics of MOS transistors at very low temperatures , 1987 .

[11]  S. Hanamura,et al.  Operation of Bulk CMOS Devices at Very Low Temperatures , 1983, 1983 Symposium on VLSI Technology. Digest of Technical Papers.

[12]  A reliable low thermal resistance bond between dielectrics and metals for use at low temperatures , 1970 .

[13]  F. Balestra,et al.  Anomalous behaviour of n-channel MOS transistor characteristics in the temperature range 4.2–14 K , 1989 .

[14]  Eddy Simoen,et al.  Model for hysteresis and kink behavior of MOS transistors operating at 4.2 K , 1988 .

[15]  H. Grubin The physics of semiconductor devices , 1979, IEEE Journal of Quantum Electronics.

[16]  S. Hanamura,et al.  Performance and hot-carrier effects of small CRYO-CMOS devices , 1987, IEEE Transactions on Electron Devices.

[17]  N. Saks,et al.  Time dependence of depletion region formation in phosphorus‐doped silicon MOS devices at cryogenic temperatures , 1979 .

[18]  D. Foty,et al.  Thermal effects in p-channel MOSFETs at low temperatures , 1989 .

[19]  S. Hanamura,et al.  Low-temperature CMOS 8 × 8 bit multipliers with sub-10-ns speeds , 1987, IEEE Transactions on Electron Devices.

[20]  S. Tewksbury,et al.  N-channel enhancement-mode MOSFET characteristics from 10 to 300 K , 1981, IEEE Transactions on Electron Devices.

[21]  S. Tewksbury Transient response of n‐channel metal‐oxide‐semiconductor field‐effect transistors during turnon at 10–25 °K , 1982 .