Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

[1]  Woon-Seong Kwon,et al.  High current induced failure of ACAs flip chip joint , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[2]  H. Reichl,et al.  Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications , 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).

[3]  Kyung-Wook Paik,et al.  Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates , 2001 .

[4]  K. Mitsuka,et al.  Low-thermal-resistance flip-chip fine package for 1-W voltage regulator IC , 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

[5]  F. Ferrando,et al.  Flip-chip on flex for 3D packaging , 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

[6]  J. Malmodin,et al.  A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive , 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).

[7]  David J. Williams,et al.  Anisotropic Conducting Adhesives for Electronic Interconnection , 1993 .