论文信息 - Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study - 字舞流文

Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study

Xiaopeng Xu | E. Zschech | T. Wyrobek | K. Yeap | I. Panchenko | L. Kong | U. Hangen | Aditya Karmakar