“ Facile approach of enhanced heat mitigation between 3 D stacked layers by introducing a submicron thick heat spreading materials " , Extended
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S. Singh | P. Supraja | A. Panigrahi | C. H. Kumar | N. Paul
[1] E. Meyhofer,et al. Study of radiative heat transfer in Ångström- and nanometre-sized gaps , 2017, Nature Communications.
[2] S. Singh,et al. Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
[3] Md. Shohrab Hossain,et al. Thermal Management in 3-D Integrated Circuits with Graphene Heat Spreaders , 2012 .
[4] Chuan Seng Tan,et al. Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs , 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
[5] M. Hove,et al. Theory of Radiative Heat Transfer between Closely Spaced Bodies , 1971 .