Experimental and CFD analysis of heat sinks with base plate for CPU cooling

Experimental and theoretical investigations of the thermal performance of a variety of heat sinks have been made. The heat sinks investigated were: straight finned, elliptical finned, small pin finned, circular disc finned, elliptical disc finned, frustum finned and double base straight finned. Realistic, manufacturable geometries are considered for minimizing thermal resistance at low velocity. The experimental results of several of the simple geometry heat sinks have been compared to those predicted by a commercially available computational fluid dynamics code fluent. The parameters such as fin geometry, fin pitch and fin height are optimized primarily in this paper and a second task is carried out to optimize base plate thicknesses, base plate materials and modify design of heat sink for improving the thermal performance in the next generation. Although the performance of heat sink is good, the temperature of heat sink at center is high. In this research work, the best heat sink geometry is selected and modified in order to reduce maximum temperature distribution and hot spots of heat sink at center by changing the geometry design and adding one more base. It is observed that flow obstructions in the chassis and the resulting air recirculation affect the heat sink temperature distribution.

[1]  C. T. Avedisian,et al.  Enhancing forced air convection heat transfer from an array of parallel plate fins using a heat pipe , 1997 .

[2]  Yunhua Gan,et al.  Microscale heat transfer enhancement using thermal boundary layer redeveloping concept , 2005 .

[3]  M. R. Spiegel.  E and M , 1981 .

[4]  Kai H. Luo,et al.  Unsteady heat transfer analysis of an impinging jet , 2002 .

[5]  Ilker Tari,et al.  CFD Modeling of Forced Cooling of Computer Chassis , 2007 .

[6]  S. Subramanyam,et al.  Rapid design of heat sinks for electronic cooling using computational and experimental tools , 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

[7]  Ralph L. Webb,et al.  Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling , 2001 .

[8]  Kambiz Vafai,et al.  An experimental investigation of the thermal performance of an asymmetrical flat plate heat pipe , 2000 .

[9]  T.-Y.T. Lee,et al.  Thermal evaluation of a PowerPC 6201 microprocessor in a multiprocessor computer , 1996 .

[10]  Cristina H. Amon,et al.  Numerical prediction of convective heat transfer in self-sustained oscillatory flows , 1990 .

[11]  Tien-Yu Tom Lee,et al.  Application of a CFD tool for system-level thermal simulation , 1993 .

[12]  Z. ZHAOt,et al.  Enhancing forced air convection heat transfer from an array of parallel plate fins using a heat pipe , 2003 .

[13]  I. E. Idelchik,et al.  Flow Resistance : A Design Guide for Engineers , 1989 .

[14]  Koichi Nishino,et al.  Turbulence statistics in the stagnation region of an axisymmetric impinging jet flow , 1996 .

[15]  Duckjong Kim,et al.  Thermal Optimization of Microchannel Heat Sink With Pin Fin Structures , 2003 .

[16]  E. Ozturk,et al.  Forced Air Cooling of CPUs With Heat Sinks: A Numerical Study , 2008, IEEE Transactions on Components and Packaging Technologies.

[17]  C.-W. Yu,et al.  Thermal design of a desktop computer system using CFD analysis , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[18]  Jong-Wook Kim,et al.  Heat pipe cooling technology for desktop PC CPU , 2003 .

[19]  Yue-Tzu Yang,et al.  Numerical Study of Thermal and Hydraulic Performance of Compound Heat Sink , 2009 .

[20]  Cristina H. Amon,et al.  Numerical and experimental studies of self-sustained oscillatory flows in communicating channels , 1992 .

[21]  HEAT TRANSFER ANALYSIS AND EVALUATION FOR TWO-PHASE FLOW IN POROUS-CHANNEL HEAT SINKS , 1997 .

[22]  Louis Gosselin,et al.  Thermal Resistance Minimization of a Fin-and-Porous-Medium Heat Sink with Evolutionary Algorithms , 2008 .

[23]  D. Lober.  Optimizing the integration of an electronics system into an existing enclosure using CFD modeling techniques , 1999 .

[24]  Bahram Moshfegh,et al.  Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass , 2001 .

[25]  Sung Jin Kim,et al.  Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow , 2008 .

[26]  Ralph L. Webb,et al.  Identification of minimum air flow design for a desktop computer using CFD modeling , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

[27]  Dereje Agonafer,et al.  Thermal Model of a PC , 1994 .