Numerical prediction of electronic component heat transfer: an industry perspective

This study aims to provide a perspective on the current capabilities of computational fluids dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for printed circuit board (PCB) mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3/spl deg/C to +22/spl deg/C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

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