Thermal cyclic fatigue of the interconnect of a flex-type BGA

Assurance of board level reliability is necessary and required for adopting any new packages into products. Therefore, there is a great interest to study solder joint reliability of a ball grid array package using flex-type substrate, which is developed and named "Film BGA" in ASE. This paper presents board level reliability test results of this flex-type package under thermal cyclic test.

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