Transient and crosstalk analysis of slightly lossy interconnection lines for wafer scale integration and wafer scale hybrid packaging-weak coupling case

An investigation is made of the transmission characteristics of wafer-scale interconnection lines which are modeled by weakly coupled lossy transmission lines. Laplace transform techniques and numerical methods are used to solve the coupled transmission-line equations in the weak coupling approximation. The authors obtain transient responses and crosstalk noise waveforms in the time domain. The modification of the coupling resulting from the losses is examined. The analysis indicates that while there is some increase in coupling resulting from the losses, the rise-time-dependent part of this coupling (which is a more severe component at high frequencies) is still suppressed for homogeneous dielectrics as is the case for lossless lines. However, other results seen in terminated lossless lines such as the absence of any coupling at the far end are degraded by the losses. A guide for determining the design parameters of the interconnection is presented along with some experimental results measured with actual fabricated wafer-scale test structures. >