Optoelectronic multichip modules for high-speed computer systems and communication networks

The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes.